? semiconductor components industries, llc, 2014 december, 2014 ? rev. 8 1 publication order number: BAS16XV2t1/d BAS16XV2 switching diode features ? high?speed switching applications ? lead finish: 100% matte sn (tin) ? qualified reflow temperature: 260 c ? extremely small sod?523 package ? s prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant maximum ratings rating symbol value unit continuous reverse voltage v r 100 v continuous forward current i f 200 ma peak forward surge current i fm(surge) 500 ma repetitive peak forward current (pulse wave = 1 sec, duty cycle = 66%) i frm 500 ma non?repetitive peak forward current (square wave, t j = 25 c prior to surge) t = 1 s t = 1 ms t = 1 s i fsm 4.0 1.0 0.5 a stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. thermal characteristics characteristic symbol max unit total device dissipation, (note 1) t a = 25 c derate above 25 c p d 200 1.57 mw mw/ c thermal resistance, junction?to?ambient r ja 635 c/w junction and storage temperature t j , t stg ?55 to 150 c 1. fr-5 minimum pad. www. onsemi.com 1 cathode 2 anode device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. sod?523 case 502 a6 = specific device code m = date code = pb?free package marking diagram 1 2 a6 m 12 BAS16XV2t1g sod?523 (pb?free) 3000 / tape & ree l BAS16XV2t5g sod?523 (pb?free) 8000 / tape & ree l (note: microdot may be in either location) sBAS16XV2t1g sod?523 (pb?free) 3000 /t ape & ree l
BAS16XV2 www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics reverse voltage leakage current (v r = 100 v) (v r = 75 v, t j = 150 c) (v r = 25 v, t j = 150 c) i r ? ? ? 1.0 50 30 a reverse breakdown voltage (i br = 100 a) v (br) 100 ? v forward voltage (i f = 1.0 ma) (i f = 10 ma) (i f = 50 ma) (i f = 150 ma) v f ? ? ? ? 715 855 1000 1250 mv diode capacitance (v r = 0, f = 1.0 mhz) c d ? 2.0 pf forward recovery voltage (i f = 10 ma, t r = 20 ns) v fr ? 1.75 v reverse recovery time (i f = i r = 10 ma, r l = 50 ) t rr ? 6.0 ns stored charge (i f = 10ma to v r = 5.0v, r l = 500 ) q s ? 45 pc notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1.0 ma output pulse (i f = i r = 10 ma; measured at i r(rec) = 1.0 ma) i f input signal figure 1. recovery time equivalent test circuit
BAS16XV2 www. onsemi.com 3 100 0.2 0.4 v f , forward voltage (volts) 0.6 0.8 1.0 1.2 10 1.0 0.1 t a = 85 c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 10 20 30 40 50 0.68 0 v r , reverse voltage (volts) 0.64 0.60 0.56 0.52 c d , diode capacitance (pf) 2468 i f , forward current (ma) figure 2. forward voltage figure 3. leakage current figure 4. capacitance t a = -40 c t a = 25 c t a = 150 c t a = 125 c t a = 85 c t a = 55 c t a = 25 c i r , reverse current ( a)
BAS16XV2 www. onsemi.com 4 package dimensions sod?523 case 502 issue e notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. e d ?x? ?y? b 2x m 0.08 x y a h c dim min nom max millimeters d 1.10 1.20 1.30 e 0.70 0.80 0.90 a 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 l 0.30 ref h 1.50 1.60 1.70 12 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e e recommended top view side view 2x bottom view l2 l 2x 2x 0.48 0.40 2x 1.80 dimension: millimeters package outline l2 0.15 0.20 0.25 p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 BAS16XV2t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
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